PT Japfa Comfeed Indonesia Tbk plans to issue Rp1.5 trillion bonds into two stages in 2012. According to sources, as quoted by Bisnis Indonesia today, Japfa will use shelf registration for the bonds issuance.
"About Rp1 trillion bonds will be offered by Japfa Comfeed at the end of this year," said a source.
Japfa has also mandated PT Bahana Securities Tbk as the underwriter. Director Andi Sidharta said Japfa has filed the bonds issuance to Bapepam-LK.
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